JPH083002Y2 - ウエットエッチング装置 - Google Patents
ウエットエッチング装置Info
- Publication number
- JPH083002Y2 JPH083002Y2 JP11830689U JP11830689U JPH083002Y2 JP H083002 Y2 JPH083002 Y2 JP H083002Y2 JP 11830689 U JP11830689 U JP 11830689U JP 11830689 U JP11830689 U JP 11830689U JP H083002 Y2 JPH083002 Y2 JP H083002Y2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- substrate
- water
- spraying mechanism
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001039 wet etching Methods 0.000 title claims description 7
- 238000005530 etching Methods 0.000 claims description 60
- 239000000126 substance Substances 0.000 claims description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 39
- 238000005507 spraying Methods 0.000 claims description 32
- 239000007788 liquid Substances 0.000 claims description 25
- 230000007246 mechanism Effects 0.000 claims description 25
- 238000005406 washing Methods 0.000 claims description 12
- 239000010408 film Substances 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- JRRBGYNZIVHUFF-UHFFFAOYSA-O [N+](=O)([O-])[O-].[NH4+].[Se] Chemical compound [N+](=O)([O-])[O-].[NH4+].[Se] JRRBGYNZIVHUFF-UHFFFAOYSA-O 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11830689U JPH083002Y2 (ja) | 1989-10-11 | 1989-10-11 | ウエットエッチング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11830689U JPH083002Y2 (ja) | 1989-10-11 | 1989-10-11 | ウエットエッチング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0357932U JPH0357932U (en]) | 1991-06-05 |
| JPH083002Y2 true JPH083002Y2 (ja) | 1996-01-29 |
Family
ID=31666480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11830689U Expired - Lifetime JPH083002Y2 (ja) | 1989-10-11 | 1989-10-11 | ウエットエッチング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083002Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011151219A (ja) * | 2010-01-22 | 2011-08-04 | Hitachi Ltd | 多層プリント回路基板の製造装置 |
-
1989
- 1989-10-11 JP JP11830689U patent/JPH083002Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0357932U (en]) | 1991-06-05 |
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